Former IBM expert discusses cooling systems, environmental stability hurdles and workforce needs for practical quantum deployment ...

Q4 2025 earnings call: record results, AI/data center-led electronics growth, Micromax/EFC deals, and 2026 guidance—read now.

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Addressing Computing’s Growing Carbon Footprint It’s no secret that our digital lives are getting bigger and bigger.

The Department of Energy (DOE) has released specifications for 26 artificial intelligence (AI) challenges under its Genesis Mission that could reshape how ...

In a long-running collaboration with GE Aerospace, researchers at the University of Melbourne in Australia have been steadily ...

High-performance computing (HPC) systems, with enormous computational capabilities, have been the go-to solution for decades ...

The Department for Science, Innovation and Technology (DSIT) is calling for input to shape the UK’s future AI compute ...

In a long-running collaboration with GE Aerospace, researchers at the University of Melbourne in Australia have been steadily ...

On 5 February, the nine projects retained for co-funding in the context of the joint call for projects "High-Performance Computing and Artificial Intelligence" were announced by the Ministry of the ...

The US DOE has launched the Teton supercomputer at INL, quadrupling computing power to accelerate high-fidelity nuclear ...

Daikin to debut advanced data center and commercial cooling technologies while also showcasing next-generation VRV, light commercial and residential HVAC solutions at the industry's premier event. LAS ...