Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: A design methodology for planar loaded antenna arrays is proposed to synthesize a perfect anomalous reflection into an arbitrary direction by optimizing the scattering characteristics of ...
Researchers from the Physical Chemistry and Theory departments at the Fritz Haber Institute have found a new way to image layers of boron nitride that are only a single atom thick. This material is ...
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