Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

Abstract: Combining antenna arrays with physical reconfigurability (i.e., origami) allows for additional degrees of freedom in operation and enables larger structures to be folded into smaller volumes ...

In a hangar-like building in Louisville, Colorado, outside Denver, crumpled plastic bottles, cans and other scraps were strewn across a giant conveyor belt. But you know what they say about one man’s ...

As a small business owner, Liz understands the unique challenges entrepreneurs face. Well-versed in the digital landscape, she combines real-world experience in website design, building e-commerce ...