As Moore’s Law continues to slow and demand for compute density and bandwidth accelerates, the semiconductor industry is rapidly shifting from monolithic SoCs to 3D multi-die designs. While 2.5D ...

Abstract: Embedded devices encapsulated by electronic packaging offer significant advantages in terms of miniaturization, cost and performance. A new packaging concept, Embedded Technology, is highly ...

Abstract: Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics ...

Materials science is an interdisciplinary field concerned with the understanding and application of the properties of matter. Materials scientists study the connections between the underlying ...