Abstract: Capacitive imaging (CI) has been successfully used in nondestructive evaluation (NDE) applications. Conventional capacitive electrodes applied to CI technology are generally planar, and only ...
Abstract: This paper is to address how to change the image ball grid array (iBGA) design to image chip scale package (iCSP) design with a minimal design effort in order to reduce package size and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results