Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
PI introduces miniaturized alignment engine platform for scalable, parallel E/O wafer-level test Parallel piezo aligners with fly height sensors enable faster PIC wa ...
Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...
Hermes-Epitek's semiconductor wafer testing solutions subsidiary, HTSI, will be listed on the over-the-counter (OTC) market on September 17, 2025. President Steven Wang stated that with artificial ...
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