One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...

Semiconductor fabrication facilities risk substantial financial exposure from incoming wafers defects. With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, ...

The semiconductor manufacturing ecosystem has begun collaborating on ways to effectively use wafer data to meet the stringent quality and reliability requirements for automotive ICs. Silicon ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...