Digital photoelasticity is a powerful optical technique that leverages the stress-induced birefringence in transparent materials to map the distribution of internal stresses. The method has evolved ...

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Earn Your Structural Engineering Certificate in Advanced Analysis from One of the Top-Ranked Engineering Schools. Through their careful examination of complex structures, both large and small, ...