Electronics components are steadily moving away from through hole parts to using surface mount technology (SMT) exclusively. While the small size of the SMT components can be intimidating, with a ...

This application note provides an in-depth discussion of the soldering process and how it relates to leaded LED lamps and display components, with the objective of serving as a guide to achieving high ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...

Improves wetting: Flux helps molten solder flow smoothly (or “wet”) across the surfaces, promoting even coverage and a strong ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...