Generic test and repair approaches to embedded memory have hit their limit. Smaller feature sizes, such as 130 nm and 90 nm, have made it possible to embed multiple megabits of memory into a single ...

In a recent study published in the journal Nature, researchers found that the recruitment of neurons to memory circuits is preceded by a cascade of molecular events induced during learning, which ...

Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...

FREMONT, Calif. — Virage Logic Corp. today claimed development of the industry's first on-chip self-test and repair memory solution for system-on-chip designs. The STAR (self-test/repair) memory ...

The Self-Test and Repair (STAR) Memory System is a solution for embedding on-chip memory test and repair in designs. It targets advanced process nodes of 90 nm and below with a unique, automated ...

Reigning as the only commercially available embedded memory self-test and repair system, the third-generation STAR memory system adds enhancements that promise faster time-to-market, lower test costs, ...