As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...

Chipmakers are ramping up 16nm/14nm finFET processes, with 10nm and 7nm now moving into early production. But at 10nm and beyond, chipmakers are running into a new set of problems. While shrinking ...

Double patterning is a class of technologies developed for photolithography to enhance the feature density of computer chips. The resolution of a photoresist pattern begins to blur at around 45 nm ...

As semiconductor technology advanced from 65nm to 7nm over the last 10 years, new challenges have arisen in design and manufacturing. Securing the IC yield means developing new methods that respond to ...