As complementary metal-oxide semiconductor (CMOS) area shrinks 50% from one node to the next, interconnect critical dimensions (CD) and pitch (or spacing) are under tight demands. At the N3 node, ...
The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...
Applied is working with all leading-edge logic chipmakers on a growing number of applications for its Sculpta ® pattern-shaping technology Introducing innovative new etch systems, CVD patterning films ...
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