EDN

Infineon Brings Next Generation of its Ultra-Low-Cost Mobile Phone Chips to the Market; X-GOLD110 Offers World’s Highest Integration for Mobile Phone Chips

Infineon Brings Next Generation of its Ultra-Low-Cost Mobile Phone Chips to the Market; X-GOLD110 Offers World's Highest Integration for Mobile Phone Chips Infineon announced its third Generation of ...
CNET

Gen Z Deserves a Cute Flip Phone. Samsung's Cheaper Foldable Is Too Pricey to Be It

Commentary: At first glance, the Galaxy Flip 7 FE is the foldable phone Gen Z has been waiting for. But it's still annoyingly unaffordable. Katie is a UK-based news reporter and features writer.
EDN

Next Generation of Monolithically Integrated Mobile Phone Chip is Optimized for Lowest System Costs and a Five Times Better Performance; And Infineon Offers Ultra-Low Cost Dual ...

Next Generation of Monolithically Integrated Mobile Phone Chip is Optimized for Lowest System Costs and a Five Times Better Performance; And Infineon Offers Ultra-Low Cost Dual SIM Integrated on a ...