Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...

For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

Semiconductor chiplets represent an advancement in microchip design. They divide traditional monolithic systems into smaller, modular components. Unlike traditional monolithic SoCs, which integrate ...