Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Dow Automotive Systems (Horgen, Switzerland) made big news at JEC Europe 2014 with the introduction of VORAFORCE, its ultralow-viscosity, fast-cure epoxy for automotive molding. Since then, says Peter ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

When reviewing the pressure vessel certification tests prescribed by the applicable norms, many of the tests are significantly influenced by the prop­erties and proper processing of the epoxy matrix ...