With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...

SAN JOSE, Calif., Feb. 26, 2024 (GLOBE NEWSWIRE) -- Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to ...

Self-aligned lithographic process techniques are playing an increasingly important role in advanced technology nodes. Even with the growing use of extreme ultraviolet (EUV) lithography, ...

Researchers, equipment vendors, and manufacturers alike are watching with growing concern as we creep every closer to the end of 193 nm optical lithography. The problem is not that there are no ...