Rochester Institute of Technology recently installed a MIRTEC MV3 OMNI automated, optical inspection machine in its Center for Electronics Manufacturing and Assembly (CEMA). The equipment enables ...

CHICAGO, March 24, 2020 /PRNewswire/ -- According to the new market research report "Automated Optical Inspection (AOI) System Market by Type (2D AOI, 3D AOI), Technology (Inline AOI, Offline AOI), ...

Teradyne Inc. recently introduced the newest member of its next-generation Optima 7000-Series of automated optical inspection systems. Launched at the annual IPC – Association Connecting Electronics ...

TOKYO--(BUSINESS WIRE)--Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, will demonstrate new automated inspection products, software, ...

In this interview, Tim Skunes from CyberOptics Corporation talks to AZoM about their 3D optical inspection technology, and how it can be used to solve challenges in SMT electronics manufacturing.

Portable 3D optical inspection with 4Di InSpec transforms surface metrology, enhancing defect detection and quality assurance ...

CHICAGO, IL—According to the new market research report “Automated Optical Inspection System Market by Type (2D AOI Systems, 3D AOI Systems), Technology (Inline AOI, Offline AOI), Industry (Consumer ...

In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is ...

To ensure that the speed of composites fabrication keeps pace with customer demand, the ability to inspect and monitor composite part quality must become an integral part of high-rate part ...

GRENOBLE, France, March 20, 2018 (GLOBE NEWSWIRE) -- UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a ...

The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power ...