Today ANSYS 18.2 was released. This latest release brings increased levels of accuracy, speed and ease-of-use – spurring more engineers to use simulation across every stage of the product lifecycle to ...

Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...

When selecting the right central processing unit (CPU) for optimizing Ansys Mechanical structural finite element analysis (FEA) software performance, there are two major players to consider: Intel and ...

Transient power is becoming much more problematic at 10/7nm, adding yet another level of complexity for design teams already wrestling with power issues caused by leakage, a variety of power ...